■关于陶瓷基板展 参展范围
1. 材料主题展示区
原材料：导热填料、聚合物基底材料、封装材料等
导/散热材料：热界面材料、导热高分子材料、碳材料、陶瓷基板、热沉材料、相变材料（储热）等
隔热材料：气凝胶、泡沫隔热材料、真空板、碳毡、复合保温隔热材料等
辅助材料与配件：离型膜、双面胶、胶粘剂、密封剂等
1. Materials
Raw Materials: thermally conductive fillers, polymer materials, package materials, etc.
Thermal Conduction\Dissipation Materials: thermal interface materi- als, thermal conductive polymer materials, carbon materials, ceramic substrate, heat sink, phase change materials (heat storage), etc.
Thermal insulation materials: aerogel materials, foam insulation materi- al, vacuum plate, carbon felt, composite thermal insulation materials, etc.
Auxiliary materials: release transfer tape, adhesive,sealant,double sided tape, etc.
2. 液冷主题展示区
原材料：冷却液，金属材料等
零部件：快接头，管路，膨胀阀，节流阀，电磁阀，泵，冷板，压缩机，蒸发器，机箱冷量分配单元、不间断电源等
液冷技术：冷板式液冷，浸没式液冷，喷淋式液冷，智能温控技术，模拟仿真与设计，数据中心解决方案等
1. Liquid Cooling
Raw Materials: coolant, metal materials, etc.
Components: quick coupling, pipeline, expansion valve, throttle valve, solenoid valve, pump, cooling plate, compressor, evaporator, tank, Coolant distribution unit, uninterruptible power supply, etc.
Liquid Cooling Technology: cold plate liquid cooling, immersion liquid cooling, spray liquid cooling, intelligent temperature control technology, simulation and design, data center solutions, etc.
3. 仪器/设备展示区
分析测试仪器：热物性测量设备，气体检测和分析，黏度计，拉力机，密度计，硬度仪，X射线衍射仪，漏液检测等
自动化设备：点胶机，涂布/覆膜/压延/收卷，碳化/石墨化，模切；研磨，分散，均质，脱泡，灌装，封装，焊接，压铸，真空注液等
1. Instruments/Equipment
Analysis and testing instruments: thermophysical properties measure- ment equipments, gas detection and analysis, viscometer, tension machine, densitometer, sclerometer, X-ray diffractometer, leakage detection, etc.
Automatic equipment: dispensing machine, coating/laminating/calen- dering/winding, carbonization/graphitization, die cutting; grinding, dispersion, homogenization, defoaming, filling, encapsulation, welding, die casting, vacuum injection, etc.
